Thermal Logic 2027

3D-IC Stacking Logic: The 2027 Architectural Thermal War

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3D-IC Stacking Logic and Vertical Chip Architecture

Article Highlights Introduction 3D-IC Stacking Logic is ending the old “Flat Silicon” era. In my early diagnostic days, expanding a system meant adding large cards to a wide, inefficient motherboard. Those machines had very little RAM and could not handle fast communication between layers. Today, for my 223rd article for Technical Bonus, we are building … Read more

Graphene Heat Dissipation vs Liquid Cooling: The 2nm Thermal Logic War

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Graphene Heat Dissipation vs Liquid Cooling 2nm Logic

Article Highlights Introduction The transition between Graphene Heat Dissipation vs Liquid Cooling marks a major turning point in the history of technical architecture. When I founded Acme Computers on April 7, 2005, I was sitting on my workshop floor trying to optimize 128MB RAM systems and 80GB IDE hard drives using loud, inefficient aluminum heat … Read more